SyLMAND (05B2-1)

• Status

  Accepting Proposals

• BEAM SIZE (HORIZONTAL X VERTICAL)

  150 mm x 15 mm

• BEAM POWER

  700 W

• WAVELENGTH

  12.4 – 0.82 Å

• ENERGY RANGE

  1 – 15 keV

• SOURCE

  Bending Magnet

Endstation(s):

Dedicated X-ray scanner for full-wafer exposure under vacuum including capabilities for inclined and aligned exposures.
 

Techniques:

• Deep X-ray lithography
• LIGA process lithography steps

Contacts

Scientist – Beamline Responsible: Garth Wells 306-657-3736

Associate Scientist: Michael Jacobs 306-657-3799
Beam Team Leaders:

• David Klymyshyn
• Sven Achenbach

Beamline Telephone: 306-657-3617
 

SyLMAND Capabilities

Polymer microfabrication capabilities:

• Polymer: Poly methyl methacrylate (PMMA) (Molecular weight = 1.6M )
• Minimum Feature size: > Dependent on design and polymer thickness.
• Polymer thickness: 100 µm to 1 mm
• X-ray Mask: Mask fabrication from CAD design is possible.
  Note: Possibility to combine similar aspect ratio layouts onto a mask to reduce cost. Please discuss with Beamline Scientist to explore this possibility.
• Standard mask layout area: 75mm Diameter

Cleanroom capabilities:

• Titanium seed layer application on substrate by sputtering
• PMMA application and customization of thickness
• Post-exposure development
• Inspection and imaging capabilities (optical and scanning electron microscopes with measurement tools)
• Metrology (Surface profiling and Z-tip)
• UV primary mask patterning and stand alone UV lithography